Antenna on sapphire structure

ABSTRACT

An antenna on a sapphire structure. The antenna includes a sapphire structure having a first side, and a second side positioned opposite the first side. The antenna also includes a first antenna trace positioned on the first side of the sapphire structure, and a second antenna trace positioned on the second side of the sapphire structure. Additionally, the antenna includes at least one via formed through the sapphire structure. The at least one via electrically connects the first antenna trace to the second antenna trace.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation patent application of U.S.Non-provisional patent application Ser. No. 14/178,623, filed Feb. 12,2014, and titled “Antenna on Sapphire Structure,” the disclosure ofwhich is hereby incorporated herein by reference in its entirety.

FIELD

The disclosure relates generally to electronic devices, and moreparticularly, to electronic device antennas formed on sapphirestructures and methods for forming the antennas on sapphire structures.

BACKGROUND

Conventional electronic devices typically include a plurality ofwireless communication systems for transmitting data. For example, wherethe electronic device includes a cellular telephone, the device mayinclude variety of wireless communication systems including: a cellularcommunication system, a local area communication system, a Wifi system,a Bluetooth system and a near field communication (NFC) system. Theseconventional wireless communication systems typically include antennasused to transmit data. That is, the wireless communication systemsincluded within the electronic device typically rely on antennas to sendand receive information or data specific to the wireless communicationsystem utilizing the antenna. As a result of conventional electronicdevices including a plurality of wireless communication systems, theelectronic device may typically include a plurality of antennas,distinct to each wireless communication system.

For example, most conventional electronic devices include NFC systems,which allow electronic devices to wirelessly share and/or transmit datato distinct electronic devices. That is, the NFC system allows thewireless sharing of data between electronic devices that are contactingor within close proximity to one another. Conventional NFC systemsutilize flexible printed circuits (FPC) in combination with coilantennas for transmitting the data between electronic devices. The FPCtypically include multiple layers, that are laminated together, toelectrically couple the antennas and/or other components of the NFCsystem included on the FPC. Additionally, the FPC typically includes alayer of ferrite material positioned adjacent the FPC to preventinterference between the antenna of the FPC and other components of theelectronic device. As a result of the laminated, multi-layerconstruction of the FPC, and the inclusion of a layer of ferritematerial, the FPC can occupy a large amount of space within the housingof the electronic device.

Additionally, the FPC used in conventional NFC systems typically lackstructural integrity. That is, the FPC include substantially flexibleproperties, which adds further processing and/or operational risks whenutilizing an FPC in an NFC system of an electronic device. For example,when installing an FPC in an electronic device, the FPC may requireadditional components to substantially fix the FPC within the housing ofthe electronic device. As such, the components used to fix the FPC mayrequire even more space within the housing of the electronic device.Additionally, where the FPC is loosened or floating within the housingof the electronic device, undesirable flexion of the FPC may disconnectthe FPC from other components of the electronic device, or may disruptthe connection of the components (e.g., antenna) on the PFC.

SUMMARY

Generally, embodiments discussed herein are related to electronic deviceantennas formed on sapphire structures and methods for forming theantennas on sapphire structures. The antenna may include antenna tracesformed on distinct sides of a sapphire structure, where the respectivetraces are in electronic communication with one another by a pluralityof vias formed in the sapphire structure or through doping the sapphirestructure. By utilizing a sapphire structure to form the antenna of awireless communication system in an electronic device, the overall sizeof the antenna may be substantially reduced. That is, as single sapphirestructure may be used to form the antenna. By reducing the size of theantenna, the space required for the antenna within the enclosure of theelectronic device may also be substantially reduced, and may allow morespace within the enclosure for other components of the electronic device(for example, providing additional space for a battery).

Additionally, the sapphire structure of the antenna may include a customconfiguration (e.g., shape). As a result of the custom configuration,the antenna may be placed in a variety of places within the enclosure ofthe electronic device and/or may include an increased area for theantenna. Furthermore, by forming the antenna on the sapphire structure,where the sapphire structure is substantially rigid, the antenna may bemore easily fixed within the enclosure of the electronic device and/ormay substantially prevent disconnection of the antenna from othercomponents of the electronic device and/or disruption of the traces onthe sapphire structure.

One embodiment may include an antenna. The antenna may be formed on, orinclude, a sapphire structure having a first side, and a second sidepositioned opposite the first side. The antenna may also include a firstantenna trace positioned on the first side of the sapphire structure,and a second antenna trace positioned on the second side of the sapphirestructure. Additionally, the antenna may include at least one via formedthrough the sapphire structure. The at least one via may electricallycouple the first antenna trace to the second antenna trace.

A further embodiment may include an electronic device. The electronicdevice may include a enclosure, and an antenna coupled to the enclosure.The antenna may include: a sapphire structure, a first antenna tracepositioned on the sapphire structure, and a second antenna tracepositioned on sapphire structure opposite the first antenna trace. Thefirst antenna trace may be electrically coupled to the second antennatrace.

Another embodiment may include a method of forming an antenna on asapphire structure. The method may include providing a sapphirestructure. The provided sapphire structure may include: a first side,and a second side positioned opposite the first side. The method mayalso include depositing a conductive material on the first side of thesapphire structure to form a first antenna trace, and depositing theconductive material on the second side of the sapphire structure to forma second antenna trace. Additionally, the method may includeelectrically coupling the first antenna trace of the sapphire structureto the second antenna trace of the sapphire structure.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1A shows an illustrative plane view of an antenna formed on asapphire structure, according to embodiments.

FIG. 1B shows an illustrative bottom view of the antenna formed on thesapphire structure of FIG. 1A, according to embodiments.

FIG. 2 shows an illustrative cross-sectional side view of the antenna ofFIG. 1A along line 2-2. The antenna of FIG. 2 is formed on a sapphirestructure, according to embodiments.

FIG. 3 shows an illustrative cross-sectional side view of an antennaformed on a sapphire structure, according to alternative embodiments.

FIG. 4 shows an illustrative perspective view of an electronic deviceutilizing an antenna, according to embodiments.

FIG. 5 shows an illustrative cross-sectional plane view of theelectronic device of FIG. 4 along line 5-5. The electronic device inFIG. 5 includes an antenna, according to embodiments.

FIG. 6 shows an illustrative cross-sectional plane view of theelectronic device of FIG. 4 along line 5-5. The electronic device inFIG. 6 includes an antenna, according to alternative embodiments.

FIG. 7A shows an illustrative front view of the electronic device ofFIG. 4. The electronic device in FIG. 7A includes a portion of anantenna, according to embodiments.

FIG. 7B shows an illustrative back view of an interior surface of theelectronic device of FIG. 4. The electronic device in FIG. 7B includes aportion of an antenna, according to embodiments.

FIG. 8 shows an illustrative front view of the electronic device of FIG.4. The electronic device in FIG. 8 includes a portion of an antennacovered by a decorative layer, according to embodiments.

FIG. 9 shows a flow chart illustrating a method for forming an antennaon a sapphire structure. This method may be performed on the antennaincluding the sapphire structure as shown in FIGS. 1A-3.

It is noted that the drawings of the invention are not necessarily toscale. The drawings are intended to depict only typical aspects of theinvention, and therefore should not be considered as limiting the scopeof the invention. In the drawings, like numbering represents likeelements between the drawings.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

The following disclosure relates generally to electronic devices, andmore particularly, to electronic device antennas formed on sapphirestructures and methods for forming the antennas on sapphire structures.

In a particular embodiment an antenna may include electrical tracesformed on distinct sides of a sapphire structure, where the respectivetraces are in electronic communication with one another through one ormore vias formed in the sapphire structure or through doping thesapphire structure. By utilizing a sapphire structure to form theantenna of a wireless communication system in an electronic device, theoverall size of the antenna may be substantially reduced. That is, asingle sapphire structure may be used to form the antenna. By reducingthe size of the antenna, the required space for the antenna within theenclosure of the electronic device may also be substantially reduced,and may allow more space within the enclosure for other components ofthe electronic device (such as a battery, electrical circuit or othercomponent). Additionally, the sapphire structure of the antenna mayinclude a custom configuration, such as a custom shape. As a result ofthe custom configuration, the antenna may be placed in a variety ofplaces within the enclosure of the electronic device and/or may includean increased area for the antenna. Furthermore, by forming the antennaon the sapphire structure, where the sapphire structure is substantiallyrigid, the antenna may be more easily fixed within the enclosure of theelectronic device and/or may substantially prevent disconnection of theantenna from other components of the electronic device and/or disruptionof the traces on the sapphire structure.

One sample, non-limiting antenna may include a sapphire structureincluding: a first side, and a second side positioned opposite the firstside. The antenna may also include a first antenna trace positioned onthe first side of the sapphire structure, and a second antenna tracepositioned on the second side of the sapphire structure. Additionally,the antenna may include at least one via formed through the sapphirestructure. The at least one via may electrically couple the firstantenna trace to the second antenna trace.

A sample, non-limiting electronic device may include an enclosure, andan antenna coupled to the enclosure. The antenna may include: a sapphirestructure, a first antenna trace positioned on the sapphire structure,and a second antenna trace positioned on sapphire structure opposite thefirst antenna trace. The first antenna trace may be electrically coupledto the second antenna trace.

A sample, non-limiting method forming an antenna on a sapphire structuremay include providing a sapphire structure. The provided sapphirestructure may include: a first side, and a second side positionedopposite the first side. The method may also include depositing aconductive material on the first side of the sapphire structure to forma first antenna trace, and depositing the conductive material on thesecond side of the sapphire structure to form a second antenna trace.Additionally, the method may include electrically coupling the firstantenna trace of the sapphire structure to the second antenna trace ofthe sapphire structure.

These and other embodiments are discussed below with reference to FIGS.1-8. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

Referring now to FIGS. 1A and 1B a plane and bottom view, respectively,of one example of an antenna 100 on a sapphire structure 102 is shown.Sapphire structure 102 may include a pre-cut piece of artificially growncorundum. That is, sapphire structure 102, as shown in FIGS. 1A and 1Bmay include a custom configured portion of sapphire, formed from alarge, artificially grown piece of corundum. The artificially growncorundum used to form sapphire structure 102 may be grown using anyconventional growth process including, but not limited to: hydrothermalgrowth; vertical horizontal gradient freezing (“VHGF”); edge-definedfilm-fed growth (“EFG”); horizontal moving growth (e.g., Bridgmangrowth); and Kyropoulos growth.

Sapphire structure 102 may include a first side 104 (FIG. 1A) and asecond side 106 (FIG. 1B) positioned opposite or adjacent first side104. Sapphire structure 102 of antenna 100, as shown in FIG. 1B, mayillustrate second side 106 by flipping or turning sapphire structure 102including first side 104 of FIG. 1A about axis A. In a non-limitingexample, as shown in FIG. 1A, first side 104 may include a top surfacefor sapphire structure 102, and second side 106 of FIG. 1B may include abottom surface of sapphire structure 102, where the top surface andbottom surface are positioned opposite one another on sapphire structure102. However, first side 104 and second side 106 may include otherportions of sapphire structure 102. For example, in alternativeembodiments, first side 104 and/or second side 106 may includeadjacent/opposite sidewalls 108, 110, a top or bottom surface andsidewall 108, 110, and any other combination of portions making upsapphire structure 102.

As shown in FIGS. 1A and 1B, sapphire structure 102 may also include aplurality of plane orientations for the surfaces of sapphire structure102. More specifically, each of the surfaces of sapphire structure 102may be in alignment with a crystallographic plane orientation determinedby the formation of sapphire structure 102. For example, as shown inFIG. 1A, sidewalls 108 of sapphire structure 102 may include an A-planecrystallographic orientation, while sidewalls 110 may include a C-planecrystallographic orientation. The crystallographic plane orientation ofsapphire structure 102 used to form antenna 100 may affect theproperties of antenna 100. That is, depending upon the crystallographicplane orientation of sapphire structure 102, the physical properties forantenna 100 may be distinct. In a non-limiting example, sapphirestructure 102 may include first side 104 in an M-plane crystallographicplane orientation. As a result of first side being formed in an M-planecrystallographic plane orientation, sapphire structure 102 may include asubstantially strong or rigid structure that may not be susceptible todeformation (for example, twisting). As such, and as discussed herein,because of sapphire structures 102 substantially rigid structure,sapphire structure may include a substantially reduced thicknesscompared to conventional antenna components.

It is understood that corundum (e.g., sapphire) is an anisotropicmaterial. As a result, the crystallographic orientation of the surfacesof components made from corundum or sapphire (e.g., sapphire structure102) may affect the physical properties and/or material characteristics(e.g., strength, ductility, elasticity) of the component. Additionally,the crystallographic orientation of sapphire structure 102 may alsoaffect the electrical properties (e.g., radio-frequency (RF) properties,RF field) of the wireless communication system utilizing antenna 100, asdiscussed herein. It is also understood that the crystallographicorientation of the various surfaces may be dependent on the growingprocesses used for creating the corundum of sapphire structure 102and/or the cutting process for forming sapphire structure 102 from thecorundum. For example, the corundum from which sapphire structure 102 isformed may be grown using an EFG growth process. In the growth process,the seed crystal may include a plane orientation to yield corundum thatmay allow for specific, desired planes (e.g., C-plane, A-plane) to beutilized in components formed from the corundum (e.g., sapphirestructure 102). By knowing the orientation of the seed crystal used inthe EFG growth process, and ultimately knowing the crystallographicorientation of the grown corundum, manufactures can cut the corundum ina specific direction to form components with surfaces having specificplane crystallographic orientations, or substantially desirable planecrystallographic orientations.

Antenna 100 may include a first antenna trace 112 positioned on sapphirestructure 102. More specifically, as shown in FIG. 1A, first antennatrace 112 of antenna 100 may be positioned on first side 104 of sapphirestructure 102. First antenna trace 112 may for one or more loops onfirst side 104 of sapphire structure 102. That is, first antenna trace112 positioned on first side 104 of sapphire structure 102 may include amulti-loop pattern 114. In a non-limiting example, as shown in FIG. 1A,first antenna trace 112 may include six (6) loops of conductive materialfor forming a portion of antenna 100. It is understood that firstantenna trace 112, as shown in FIG. 1A is merely exemplary, and in otherembodiments first antenna trace 112 may include a single loop pattern ora plurality of loops of conductive material for forming antenna 100. Theconductive material forming first antenna trace 112 may include anymaterial including electrically conductive properties including, but notlimited to: copper, aluminum and indium tin oxide (ITO).

As shown in FIG. 1A, first antenna trace 112 of antenna 100 may includea first end 116 and second end 118 positioned opposite first end 116.More specifically, first end 116 may be positioned substantially withinand/or may be substantially surrounded by the multi-loop pattern 114 offirst antenna trace 112, and may be positioned adjacent the center ofsapphire structure 102. Second end 118 may be positioned substantiallyoutside of multi-loop pattern 114 of first antenna trace 112. Second end118 may also be positioned adjacent or within proximity of an exposededge 120 of sapphire structure 102. As shown in FIG. 1A, first end 116and second end 118 may not be aligned on first side 104 of sapphirestructure 102. That is, and as discussed herein, first end 116 andsecond end 118 of first antenna trace 112 may be separated to notinterfere with additional connection points of antenna 100 used tocouple and/or electrically connect antenna 100 to the wirelesscommunication system utilizing antenna 100 and/or additional componentsof the electronic device (see, FIG. 4) including antenna 100.

Antenna 100 may also include a ground element 122 positioned on firstside 104 of sapphire structure 102. More specifically, as shown in FIG.1A, ground element 122 may be positioned on first side 104,substantially adjacent to and/or surrounding first antenna trace 112.Ground element 122 may be positioned adjacent sidewalls 108, 110 ofsapphire structure 102, and may include at least one break or opening124 to form exposed edge 120 of sapphire structure 102. That is, groundelement 122 may substantially surround first antenna trace 112, but mayinclude opening 124 to form exposed edge 120, where second end 118 offirst antenna trace 112 may be positioned within opening 124 of groundelement 122, proximate to exposed edge 120. As discussed herein, groundelement 122 of antenna 100 may be electrically coupled to the electronicdevice (see, FIG. 4) for substantially grounding antenna 100 duringoperation within the electronic device.

Turning to FIG. 1B, antenna 100 may also include a second antenna trace126 positioned on sapphire structure 102 opposite first antenna trace112. That is, second antenna trace 126 may be positioned on second side106 of sapphire structure 102, opposite first antenna trace 112positioned on first side 104. Second antenna trace 126 may include twodistinct lines of a conductive material formed on second side 106. Morespecifically, second antenna trace 126 may include a first contact line128 including a first contact pad 130, and a second contact line 132including a second contact pad 134, wherein second contact line 132 isdistinct from first contact line 128. As shown in FIG. 1B, first contactpad 130 and second contact pad 134 may be positioned substantiallyadjacent to exposed edge 120 of sapphire structure 102. That is, firstcontact pad 130 and second contact pad 134 may be positioned withinopening 124′ formed in ground element 122′ of second side 106, adjacentto exposed edge 120. As shown in FIG. 1B, ground element 122′ may bepositioned on second side 106 of sapphire structure 102, adjacent and/orsubstantially surrounding second antenna trace 126. Ground element 122′and opening 124′ of second side 106 may be substantially similar toground element 122 and opening 124 of first side 104. As such, redundantexplanation of these components is omitted for clarity.

First contact pad 130 and second contact pad 134 may be separated by adistance equal to the distance separating first end 116 and second end118 of first antenna trace 112, as shown in FIG. 1A. As discussedherein, first contact pad 130 and second contact pad 134 may beconfigured to electrically connect antenna 100 to the wirelesscommunication system utilizing antenna 100 and/or additional componentsof the electronic device (see, for example, FIG. 4). That is, and asdiscussed herein, first contact pad 130 and second contact pad 134 ofsecond antenna trace 126 may contact distinct components, circuitries orsystems that may utilize antenna 100 during the operation of theelectronic device (see, for example, FIG. 4).

The conductive material forming first contact line 128 and secondcontact line 132 of second antenna trace 126 may include any materialincluding electrically conductive properties similar to the conductivematerial used to form first antenna trace 112. That is, the conductivematerial used to form second antenna trace 126 may include, but is notlimited to: copper, aluminum and indium tin oxide (ITO). The conductivematerial used to form first antenna trace 112 (see, FIG. 1A) and secondantenna trace 126 of antenna 100 may be the same material or distinctmaterials.

As shown in FIG. 1B, first contact line 128 may include an end 136positioned opposite first contact pad 130, and second contact line 132may include an end 138 positioned opposite second contact pad 134. Asdiscussed herein, end 136 of first contact line 128 may be insubstantial alignment with first end 116 of first antenna trace 112(see, FIG. 1A) through sapphire structure 102. Additionally, end 138 ofsecond contact line 132 may be in substantial alignment with second end118 of first antenna trace 112 (see, FIG. 1A) through sapphire structure102, as discussed herein.

Turning to FIG. 2, a cross-sectional side view of sapphire structure 102of antenna 100 along line 2-2 of FIG. 1A is shown. As shown in FIG. 2,antenna 100 may also include at least one via 140, 142 formed throughsapphire structure 102. A first via 140 and a second via 142 (shown inphantom) may be formed through sapphire structure 102 to electricallycouple first antenna trace 112 to second antenna trace 126. First via140 may be formed through sapphire structure 102 to electrically couplefirst end 116 of first antenna trace 112 and end 136 of first contactline 128 of second antenna trace 126. That is, where first end 116 offirst antenna trace 112 and end 136 of first contact line 128 of secondantenna trace 126 are in substantial alignment, first via 140 may beformed through sapphire structure 102, in alignment with first end 116and end 136, to electrically coupled first antenna trace 112 and secondantenna trace 126. First via 140 may be filled with a conductivematerial to electrically coupled first antenna trace 112 and secondantenna trace 126. More specifically, as shown in FIG. 2, first via 140may be filled with the same conductive material used to form firstantenna trace 112 and/or second antenna trace 126, to electricallycouple first antenna trace 112 and second antenna trace 126.

Second via 142 (shown in phantom) may be formed through sapphirestructure 102 substantially adjacent to exposed edge 120 of sapphirestructure 102. More specifically, second via 142 may be formed throughsapphire structure 102 to electrically couple second end 118 of firstantenna trace 112 and end 138 of second contact line 132 of secondantenna trace 126. End 138 of second contact line 132 may be insubstantial alignment with second end 118 of first antenna trace 112. Asa result, second via 142 may be formed through sapphire structure 102,in alignment with second end 118 and end 138, to electrically couplefirst antenna trace 112 and second antenna trace 126. As similarlydiscussed with respect to first via 140, second via 142 may be filledwith the conductive material to electrically coupled first antenna trace112 and second antenna trace 126.

As shown in FIG. 2, by electrically coupling first antenna trace 112 andsecond antenna trace 126 using vias 140, 142, first antenna trace 112may also be electrically coupled to first contact pad 130 and secondcontact pad 134, respectively. That is, by electrically coupling firstend 116 to end 136 using first via 140, and electrically coupling secondend 118 to end 138 (see, FIG. 1B) by second via 142 (shown in phantom),first antenna trace 112 may be electrically coupled to first contact pad130 of first contact line 128 and second contact pad 134 of secondcontact line 132, respectively. As discussed herein, where antenna 100is included within an electronic device (see, FIG. 4), the electricalcoupling of the first antenna trace 112 to the first contact pad 130 andthe second contact pad 134, respectively, may allow antenna 100 totransmit data to/from the electronic device to/from another electronicdevice.

In another embodiment, as shown in FIG. 3, antenna 100 may not includeat least one via 140, 142, as discussed herein with respect to FIG. 2.It is understood that similarly numbered components may function in asubstantially similar fashion. Redundant explanation of these componentshas been omitted for clarity. As shown in FIG. 3, at least a portion ofsapphire structure 102 may be substantially doped 144. Morespecifically, the areas of sapphire structure 102 of antenna 100 thatare positioned between the substantially aligned respective ends (e.g.,first end 116, second end 118, ends 136, 138) of first antenna trace 112and second antenna trace 126 may be substantially doped 144, to increaseconductively between first antenna trace 112 and second antenna trace126. That is, dopants may be added to sapphire structure 102 during theformation of antenna 100, as discussed herein, to dope at least aportion 144 of sapphire structure 102, such that first antenna trace 112may be electrically coupled to second antenna trace 126 via the dopedareas 144 of sapphire structure 102. End 116 of first antenna trace 112may be electrically coupled to end 136 of first contact line 128 ofsecond antenna trace 126 via the doped area 144 of sapphire structure102 positioned between, and in substantial alignment with first end 116and end 136, respectively. Additionally, second end 118 of first antennatrace 112 may be electrically coupled to end 138 of second contact line132 of second antenna trace 126 via the doped area 144 of sapphirestructure 102 positioned between, and in substantial alignment withsecond end 118 and end 138, respectively. It is understood that bydoping at least a portion sapphire structure 102, the electricalproperties of sapphire structure 102 may be substantial modified. Morespecifically, the doped areas 144 of sapphire structure 102 may be moreelectrically conductive and/or may allow electrical current to passthrough sapphire structure 102 from the first antenna trace 112 tosecond antenna trace 126.

Turning to FIG. 4, a perspective view of one example of an electronicdevice 400 including an antenna 100 (FIGS. 1A and 1B) is shown. In theillustrated embodiment, electronic device 400 is implemented as a smarttelephone. Other embodiments can implement electronic device 400differently, such as, for example, as a laptop or desktop computer, atablet computing device, a gaming device, a display, a digital musicplayer, a wearable computing device or display, a health monitoringdevice, and so on.

Electronic device 400 includes an enclosure 402 at least partiallysurrounding a display 404 and one or more buttons 406 or input devices.Enclosure 402 can form an outer surface or partial outer surface andprotective case for the internal components of the electronic device400, and may at least partially surround display 404. Enclosure 402 canbe formed of one or more components operably connected together, such asa front piece and a back piece. Alternatively, enclosure 402 can beformed of a single piece operably connected to display 404.Additionally, enclosure 402 may be formed from a variety of materialincluding, but not limited to: reinforced glass, plastic, artificiallygrown corundum, and any combination of material. That is, enclosure 402may be formed from identical or substantially similar sapphire materialused to form sapphire structure 102 of antenna 100 (see, FIGS. 1A and1B).

Display 404 can be implemented with any suitable technology, including,but not limited to, a multi-touch sensing touchscreen that uses liquidcrystal display (LCD) technology, light emitting diode (LED) technology,organic light-emitting display (OLED) technology, organicelectroluminescence (OEL) technology, or another type of displaytechnology. Button 406 can take the form of a home button, which may bea mechanical button, a soft button (e.g., a button that does notphysically move but still accepts inputs), an icon or image on adisplay, and so on. Further, in some embodiments, button 406 can beintegrated as part of a cover glass of the electronic device.

Electronic device 400 may also include a plurality of openingsthroughout enclosure 402. The openings in enclosure 402 of electronicdevice 400 may provide access from external comments of electronicdevice 400 to internal components. In a non-limiting example, electronicdevice 400 may include a battery charging port 408 included in enclosure402. As shown in FIG. 4, battery charging port 408 may be in electroniccommunication with a battery 410 (see, FIG. 5) of electronic device 400included within an internal cavity 412 (see, FIG. 5) of enclosure 402.More specifically, battery charging port 408 may include an apertureformed in enclosure 402, configured to receive a portion of a chargingdevice (not shown) for charging battery 410. That is, battery chargingport 408 positioned on the exterior of enclosure 402 may be coupled to acharging device, such that the charging device may provide an electriccurrent to electronic device 400 to substantially charge battery 410positioned within enclosure 402.

FIG. 5 shows a cross-sectional plane view of electronic device 400 alongline 5-5. As shown in FIG. 5, enclosure 402 of electronic device 400 maysubstantially surround internal cavity 412 of electronic device 400. Asdiscussed herein, internal cavity 412 of enclosure 402 may includebattery 410 in electronic communication with battery charging port 408of electronic device 400. Internal cavity 412 of enclosure 402 may alsoinclude a plurality of internal components 414. More specifically, asshown in FIG. 5, electronic device 400 may include a plurality ofinternal component 414 that may be positioned within internal cavity 412of enclosure 402. The plurality of internal components 414 may includevarious electronic components and/or systems that provide electronicdevice 400 with functionality. For example, as shown in FIG. 5, theplurality of internal component 414 may include a communication system416, that may utilize antenna 100 for transmitting data of electronicdevice 400, as discussed herein. The plurality of internal components414 may also include, but are not limited to: graphic card,processor(s), memory or storage device(s), and sensors.

As shown in FIG. 5, and discussed herein, electronic device 400 mayinclude antenna 100. Antenna 100 as shown in FIG. 5, may besubstantially similar to, and function similarly to antenna 100discussed herein with respect FIGS. 1A-3. As such, redundant explanationis omitted for clarity. Antenna 100 may be coupled to enclosure 402 ofelectronic device 400. More specifically, antenna 100 may be positionedwithin and/or coupled to internal cavity 412 of enclosure 402, adjacentthe plurality of internal component 414 of electronic device 400.Antenna 100, as shown in FIG. 5, may display second side 106 of sapphirestructure 102 including second antenna trace 126. Second side 106 ofsapphire structure 102 of antenna 100 may be positioned adjacent display404 (FIG. 4) within internal cavity 412 based on the positioning ofcommunication system 416 of electronic device 400. That is, second side106 may be positioned adjacent display 404 and visible in FIG. 5, ratherthan first side 104 (see, FIG. 1A), based upon the connection terminals418 of communication system 416. As shown in FIG. 5, first contact pad130 of first contact line 128, and second contact pad 134 of secondcontact line 132 may be electrically coupled to connection terminals 418of communication system 416 via a plurality of connecters 420. Antenna100 may be in electronic communication with communication system 416 totransmit data of electronic device 400, as discussed herein.Communication system 416 may include any wireless communication that maybe included in electronic device 400 for sending/receiving dataincluding, but not limited to: a cellular communication system, a localarea communication system, a Wifi system, a Bluetooth system and a nearfield communication (NFC) system.

Sapphire structure 102 of antenna 100 may include a configuration to fitwithin internal cavity 412 of enclosure 402 of electronic device 400.More specifically, as shown in FIG. 5, sapphire structure 102 of antennamay include a configuration or shape that may be positioned within avoid 421 within internal cavity 412. Void 421 may include an unoccupiedspace within internal cavity 412 that does not include a portion of theplurality of internal components 414 of electronic device 400. As aresult, sapphire structure's 102 configuration or shape may be dependentupon the size of internal cavity 412 and/or the positioning of theplurality of internal components 414 within internal cavity 412 ofenclosure 402. Because sapphire structure's 102 configuration isdependent on the shape/size of internal cavity 412 and/or the pluralityof internal components 414, sapphire structure 102 of antenna 100 may besubstantially customizable and/or may be installed within electronicdevice 400 subsequent to the installation of the plurality of internalcomponents 414. The configuration dependency and/or customizable optionof sapphire structure 102 of antenna 100 may enable antenna 100 toinclude a large sapphire structure 102, and/or larger first antennatrace 112 and second antenna trace 126, which may ultimately increasethe strength of antenna 100. In a non-limiting example, as shown in FIG.6, sapphire structure 102 may include a substantially polygonalconfiguration or shape that may fit within void 421 of internalcomponent 414. More specifically, sapphire structure 102, may include anon-uniform configuration, that may be positioned within void 421 andmay be substantially surround by protrusion 422 formed by the pluralityof internal components 414 positioned within internal cavity 412 ofenclosure 402.

FIG. 7A shows a front view of a portion of electronic device 400including battery charging port 408 and a portion of antenna 100. Asdiscussed herein, enclosure 402 of electronic device 400 may be madefrom the same sapphire material (e.g., artificially grown corundum) usedto form sapphire structure 102 of antenna 100. Where enclosure 402 ismade from a sapphire material, as shown in FIG. 7A, enclosure 402 mayinclude an outer surface or protective case for electronic device 400,and may also provide the sapphire structure 102 (FIGS. 1A-3) for antenna100. In an embodiment where enclosure 402 is made from sapphire materialand provides sapphire structure 102 for antenna 100, a portion ofantenna 100 may be positioned on enclosure 402 of electronic device 400.More specifically, as shown in FIG. 7A, first antenna trace 112 ofantenna 100 may be positioned on an exterior surface 424 of enclosure402. Exterior surface 424 of enclosure 402 may be substantially similarto first side 104 of sapphire structure 102, as discussed herein withrespect to FIG. 1A. As shown in FIG. 7A, first antenna trace 112 mayinclude multi-loop pattern 114 that may be formed on exterior surface424 around the openings formed through enclosure 402. That is, firstantenna trace 112 may be formed on exterior surface 424 around batterycharging port 408 and additional openings, including connection aperture426, and speaker/microphone aperture 427 formed through enclosure 402.Connection aperture 426 may include an aperture or hole formed throughenclosure 402 and configured to receive a fastening component (notshown) to coupled enclosure 402 to internal component 414 and/or couplethe various components forming enclosure 402.

Antenna 100 may utilize openings (e.g., battery charging port 408,connection aperture 426) formed in enclosure 402 to act as vias 140, 142(see, FIG. 2) for connecting first antenna trace 112 to second antennatrace 126. That is, where a portion of antenna 100 is formed on exteriorsurface 424 of electronic device 400, antenna 100 may utilizepre-existing openings formed in enclosure 402 for distinct purposes(e.g., charge battery) to also act or be configured as vias forelectrically connecting first antenna trace 112 to second antenna trace126. As shown in FIG. 7A, first end 116 of first antenna trace 112 maybe positioned within a portion of connection aperture 426. That is,first end 116 of first antenna trace 112 may be in alignment withconnection aperture 426 formed in enclosure 402. Additionally, as shownin FIG. 7A, second end 118 of first antenna trace 112 may be positionedwithin a portion of battery charging port 408 of electronic device 400.More specifically, as shown in FIG. 7A, second end 118 may be inalignment with a portion of battery charging port 408 formed inenclosure 402. Each of the respective openings (e.g., battery chargingport 408, connection aperture 426) formed through enclosure 402 ofelectronic device 400 may include conductive material formed in theportion of the opening in alignment with the respective ends (e.g.,first end 116, second end 118). The conductive material in therespective openings of enclosure 402 may be substantially similar to theconductive material positioned within vias 140, 142, as discussed hereinwith respect to FIG. 2. That is, connection aperture 426 may includeconductive material, similar to the conductive material of first antennatrace 112, positioned through the portion of connection aperture 426 inalignment with first end 116 of first antenna trace 112, and end 136 offirst contact line 128 of second antenna trace 126, as discussed herein.Additionally, the portion of battery charging port 408 in alignment withsecond end 118 of first antenna trace 112 and end 138 of second contactline 132 of second antenna trace 126 may include the conductivematerial. As similarly discussed herein with respect to FIG. 2, theconductive material in battery charging portion 408 and connectionaperture 426, respectively, may electrically couple first antenna trace112 positioned on exterior surface 424 of enclosure 402 and secondantenna trace 126 positioned within internal cavity 412 (see, FIG. 7B).It is understood that the conductive material positioned within therespective openings (e.g., battery charging port 408, connectionaperture 426) formed through enclosure 402 of electronic device 400 maynot substantially obstruct the primary function of the openings. Thatis, the conductive material may only be positioned on a portion of thesidewalls of the respective openings, enough to electrically coupledfirst antenna trace 112 and second antenna trace 126, withoutinterfering with the function of the openings with respect to electronicdevice 400.

It is understood that the multi-loop pattern 114 of first antenna trace112 formed on enclosure 402 may include any pattern that forms acontinuous trace of conductive material between first end 116 and secondend 118. That is, first antenna trace 112 may include multi-loop pattern114 that may include any customizable configuration or shape forproviding an antenna trace for antenna 100. In another exemplaryembodiment, multi-loop pattern 114 of first antenna trace 112 mayinclude a pattern substantially similar to a logo or brand mark of themanufacturer or seller of electronic device 400.

FIG. 7B shows a back view of the portion of electronic device 400including battery charging port 408, as shown in FIG. 7A. That is, FIG.7B may shows an interior surface 428 of a portion of enclosure 402 ofelectronic device 400, positioned adjacent internal cavity 412 ofenclosure 402 (see, FIG. 5). Interior surface 428 may be oppositeexterior surface 424 of enclosure 402 (see, FIG. 7A). As shown in FIG.7B, second antenna trace 126 may be positioned on interior surface 428of enclosure 402. More specifically, interior surface 428 may includefirst contact line 128 including first contact pad 130 and end 136,second contact line 132 including second contact pad 134 and end 138.Where enclosure 402 may be formed from a sapphire material, interiorsurface 428 may be substantially similar to second side 106 of sapphirestructure 102 of antenna 100, as discussed above with respect to FIG.1B.

As shown in FIG. 7B, end 136 of first contact line 128 may be positionedwithin a portion of connection aperture 426, and may be substantiallyaligned with first end 116 of first antenna trace 112 (see, FIG. 7A).That is, end 136 of first contact line 128 positioned on interiorsurface 428 may be substantially in alignment with first end 116, andmay be electrically coupled to first antenna trace 112 via theconductive material positioned within connection aperture 426, asdiscussed herein. Additionally, end 138 of second contact line 132 maybe positioned within a portion of battery charging port 408, and may besubstantially aligned with second end 118 of first antenna trace 112(see, FIG. 7A). That is, end 138 of second contact line 132 positionedon interior surface 428 may be substantially in alignment with secondend 118, and may be electrically coupled to first antenna trace 112 viathe conductive material positioned within battery charging port 408.

By utilizing existing openings (e.g., battery charging port 408,connection aperture 426) formed in enclosure 402, antenna 100 may beincluded on exterior surface 424 of enclosure 402 without requiringadditional holes to be formed in enclosure 402 of electronic device 400.That is, antenna 100 may utilize existing openings in enclosure 402 toperform the primary function of electronic device 400, and the openingsmay also include conductive material for electrically coupling firstantenna trace 112 to second antenna trace 126 of antenna 100, withoutforming openings specific to antenna 100. With less openings inenclosure 402 of electronic device 400, electronic device 400 maysubstantially less susceptible to damage caused by contaminants (e.g.,liquids, dust, etc.) entering internal cavity 412 via the openings.

Turning to FIG. 8, a front view of a portion of electronic device 400including battery charging port 408 and a portion of antenna 100 isshown. As shown in FIG. 8, first antenna trace 112 (shown in phantom) ofantenna 100 may be positioned on exterior surface 424 of enclosure 402,as discussed herein with respect to FIG. 7A. Additionally, as shown inFIG. 8, enclosure 402 may include a decorative layer 430 applied toexterior surface 424 of enclosure 402 including first antenna trace 112of antenna 100. Decorative layer 430 may be deposited on enclosure 402including first antenna trace 112 of antenna 100 to substantially coatenclosure 402 in a uniform material. The decorative layer 430 may alsosubstantially cover first antenna trace 112 of antenna 100 positioned onenclosure 402 to hide or prevent first antenna trace 112 from beingvisible to a user of electronic device 400. Decorative layer 430 mayinclude any conventional material that be substantially opaque andsubstantially heat resistant including, but not limited to: paint, ink,polymer sticker, etc.

Turning to FIG. 9, a method for forming an antenna 100 on a sapphirestructure 102 (see, FIGS. 1A-3) is now discussed. Specifically, FIG. 9is a flowchart depicting one sample method 900 for forming antenna 100on sapphire structure 102 as discussed herein with respect to FIGS.1A-3.

In operation 902, a sapphire structure may be provided. The sapphirestructure provided may include a first side, and a second sidepositioned opposite to the first side. As discussed herein, the providedsapphire structure may include a customized or unique shape orconfiguration. The configuration or shape of the provided sapphirestructure may be dependent upon the dimensions of the space within anelectronic device which the antenna may be positioned and/or the size ofthe components positioned adjacent the antenna within the electronicdevice.

In operation 904, a conductive material may be deposited on the firstside of the sapphire structure to form a first antenna trace. Theconductive material may be deposited directly on the first side of thesapphire structure without an intermediate layer. The depositing of theconductive material on the first side may be performed using a pluralityof deposition techniques. More specifically, the depositing of theconductive material may include, but is not limited to: screen printingthe conductive material on the first side of the sapphire structure,sputtering the conductive material on the first side of the sapphirestructure, etching the conductive material on the first side of thesapphire structure, or any combination of deposition techniquesdiscussed herein. The depositing of the conductive material to form thefirst antenna trace may also include patterning the deposited conductivematerial. As discussed herein, the first antenna trace may include amulti-loop pattern formed on the first side of the sapphire structure.The multi-loop pattern of the first antenna trace may be formed byperforming a patterning process on the conductive material deposited onthe first side of the sapphire structure for the antenna. In anon-limiting example, the patterning process may include performing aphotolithography process on the first side of the sapphire structureusing a photomask which includes the multi-loop pattern of the firstantenna trace.

In operation 906, a conductive material may be deposited on the secondside of the sapphire structure to form a second antenna trace. Theconductive material may be deposited directly on the second side of thesapphire structure using similar deposition techniques discussed abovewith respect to operation 904. The depositing of the conductive materialto form the second antenna trace may include depositing the conductivematerial to form a first contact line and a second contact line. Morespecifically, operation 906 may include depositing the conductivematerial to form the first contact line that may include: an end insubstantial alignment with a first end of the first antenna trace, and afirst contact pad that may electrically couple the antenna with acommunication system utilizing the antenna, as discussed herein.Additionally, operation 906 may include depositing the conductivematerial to form the second contact line that may include: an end insubstantial alignment with a second end of the first antenna trace, anda second contact pad that may also electrically couple the antenna withthe communication system utilizing the antenna, as discussed herein.

Intermediate steps may also be performed in forming an antenna using thesample method 900 as depicted in FIG. 9. For example, the intermediatesteps of depositing a ground element to the first side and the secondside of the sapphire structure may be performed. More specifically, afirst ground element may be deposited on the first side of the sapphirestructure, adjacent the first antenna trace, and a second ground elementmay be deposited on the second side of the sapphire structure, adjacentthe second antenna trace. The depositing of the first ground element andsecond ground element may be performed before or after operation 904and/or operation 906. That is, the depositing of the first groundelement may be performed before or after the depositing of theconductive material on the first side and/or the depositing of theconductive material on the second side. Additionally, the depositing ofthe second ground element may be performed before or after thedepositing of the conductive material on the second side and/or thedepositing of the conductive material on the second side.

In operation 908, the first antenna trace of the sapphire structure maybe electrically coupled to the second antenna trace of the sapphirestructure. More specifically, the first antenna trace formed on thefirst side of the sapphire structure may be in electronic communicationwith the second antenna trace formed on the second side of the sapphirestructure, opposite the first side. The electrical coupling of the firstantenna trace and the second antenna trace may allow the antenna totransmit data to and from the electronic device utilizing the antennaand respective communication systems, as discussed herein.

The electrical coupling of the first antenna trace and the secondantenna trace in operation 908 may include a plurality of distinctprocesses and configurations for the antenna. In an embodiment, theelectrical coupling of the first antenna trace to the second antennatrace in operation 908 may also include forming at least one via throughthe sapphire structure of the antenna and depositing a conductivematerial into the at least one via. The forming of the via and thedepositing of the conductive material into the via may be performedbefore or after operations 904 and/or 906. As discussed herein, two viasmay be formed through the sapphire structure, and each via may be formedin substantially alignment with the actual or anticipated ends of therespective first antenna trace and the second antenna trace.Additionally, as discussed herein, the depositing of the conductivematerial into the vias that may be in substantial alignment with theends of the respective first antenna trace and the second antenna tracemay electrically couple the antenna traces of the antenna. That is, theconductive material deposited into the vias may contact both the firstantenna trace and the second antenna trace and may provide an electricalconnection between the first antenna trace and the second antenna trace,as discussed herein.

In an alternative embodiment, the electrical coupling in operation 908may include doping at least a portion of the sapphire structure of theantenna. More specifically, the electrical coupling of the first antennatrace and the second antenna trace of the antenna may include: doping atleast the portions of the sapphire structure positioned between the endsof the first antenna trace and the ends of the second antenna trace. Asdiscussed herein with respect to operation 404 and operation 406, therespective ends of the second antenna trace may be in substantialalignment with the respective ends of the first antenna trace. By dopingat least the portions of the sapphire structure positioned between thesubstantially aligned, respective ends of the first antenna trace andthe second antenna trace, the sapphire structure may allow electricalcommunication between the first antenna trace and the second antennatrace, as discussed herein.

In utilizing a sapphire structure to form an antenna, as discussedherein, the manufacturing of the antenna may be simplified. Morespecifically, by including a sapphire structure in the antenna, theantenna traces may be formed directly on the sapphire structure insteadof distinct components. Additionally, because of the sapphirestructure's rigid structural characteristics, the overall height of theantenna may be substantially decreased. That is, only a single, thin,rigid layer of sapphire may be used to form the antenna. The decrease inheight may result in additional space within the electronic deviceutilizing the antenna, and/or may separate the antenna further fromother communication devices within the electronic device. The increasedseparation between the antenna and other components of the electronicdevice may substantially minimize the risk of antenna causinginterference with other components of the electronic device. As such,the use of a ferrite material to block or protect the antenna signal maybe substantially eliminated. Furthermore, as a result of the structuralcharacteristics of the sapphire structure, the sapphire structure of theantenna may include a customized or unique shape, that may allow antennato be placed in different portions of the electronic device and/or allowantenna to include a larger surface area for the antenna traces, withoutoccupying additional space within the electronic device. As a result ofthe increased surface area for the antenna traces, the signal strengthof the antenna may be increased, while the space the antenna occupies inthe electronic device decreases. Finally, a portion of the antenna maybe formed on the exterior surface of the electronic device, where theelectronic device includes a sapphire structure. The antenna formed onthe exterior surface of the electronic device may utilize openingsformed in the electronic device for distinct functions other than thefunctions of the antenna. As such, the antenna including a portionformed on the exterior surface of the electronic device may not createmore openings within the electronic device, while providing a strongerantenna signal for the electronic device.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not target to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

We claim:
 1. An electronic device comprising: an enclosure; a displaypositioned at least partially within the enclosure; a communicationsystem positioned within the enclosure a sapphire structure positionedabove the display and comprising; an antenna positioned on a side of thesapphire structure facing the display, the antenna operatively coupledto the communication system; and a decorative layer formed on the sideof the sapphire structure.
 2. The electronic device of claim 1, whereinthe sapphire structure includes at least two sidewalls having a C-planecrystallographic plane orientation.
 3. The electronic device of claim 1,wherein the side of the sapphire structure has an M-planecrystallographic plane orientation.
 4. The electronic device of claim 1,wherein the antenna includes a loop pattern.
 5. The electronic device ofclaim 4, wherein the antenna includes: a first contact line including afirst contact pad; and a second contact line including a second contactpad, the second contact line distinct from the first contact line. 6.The electronic device of claim 5, wherein the antenna is operativelycoupled to the communication system by the first and second contactpads.
 7. The electronic device of claim 1, further comprising agrounding layer positioned proximate to the antenna.
 8. An electronicdevice comprising: an enclosure formed from a conductive material anddefining an opening; a sapphire structure positioned over the opening;and an antenna coupled to the sapphire structure on a surface that facesthe enclosure; and an ink layer deposited on the sapphire structure in aregion proximate to the antenna.
 9. The electronic device of claim 8,wherein the antenna is a trace formed on the surface of the sapphirestructure.
 10. The electronic device of claim 8, wherein the enclosureincludes multiple internal components positioned within an internalcavity of the enclosure.
 11. The electronic device of claim 10, furthercomprising a display positioned within the opening of the enclosure. 12.The electronic device of claim 10, wherein the ink layer masks theantenna and a window aligned with an internal component of theelectronic device.
 13. The electronic device of claim 10, wherein themultiple internal components includes a communication system that isoperatively coupled to the antenna.
 14. The electronic device of claim13, wherein the communication system includes a wireless communicationsystem configured to send and receive data.
 15. The electronic device ofclaim 8, wherein the antenna is a trace formed on the surface of thesapphire structure.
 16. A method of forming an antenna on a sapphirestructure, the method comprising: depositing a conductive material on aside of the sapphire structure to form the antenna; and depositing adecorative layer on the side of the sapphire structure in a regionproximate to the antenna.
 17. The method of claim 16, furthercomprising: depositing a ground element on the side of the sapphirestructure, adjacent the antenna.
 18. The method of claim 16, wherein thedepositing of the conductive material on the side of the sapphirestructure includes one of: screen printing the conductive material onthe side of the sapphire structure, sputtering the conductive materialon the side of the sapphire structure, or etching the conductivematerial on the side of the sapphire structure.
 19. The method of claim16, further comprising patterning the deposited conductive material toform an antenna trace on the side of the sapphire structure.